FSPCBAの日記FSPCBAの日記Copyright (C) 2009-2026 Q-Eng.com All rights reserved.Q-EngThe Development Trend of BGA Assembly Technologyhttp://q-eng.com/diary/230862023-03-16T11:32:44Z2023-03-16T11:32:44Zhttps://meropost.com/u/FSPCBA/?contentId=56374
Comparison of BGA and QFP
BGA components are typically very durable and can continue to function even if they are dropped, which is not possible with PQFP. The advantage of BGA lies in its array form, as BGA components usually provide more I/O than QFP under the same area. When the number of I/O exceeds 250, the size of BGA is always smaller than that of QFP. The larger pitch of BGA also makes it easier to install and relatively more efficient. BGA assembly failure rates due to testing and packaging-related defects before assembly can be lower than 1ppm.
The biggest challenge in BGA assembly is the issue of package-related defects, which can be caused by missing solder balls, moisture sensitivity, bumps during shipping, and excessive warpage during reflow soldering. The defect rate allowed for BGA assembly is the lowest, and there may be double-layer solder balls and metallization-related defects at the solder joint position, such as insufficient soldering between the solder balls and the component pads. https://fs-technology.bravesites.com/entries/general/BGA-...
The BGA package is characterized by having shorter leads than QFP, resulting in excellent electrical performance. However, the cost of BGA is its biggest drawback, as BGAs are more expensive than QFPs in terms of laminate and resin costs associated with substrate-carrying components. BGAs use higher-cost BT resins, ceramic and polyimide resin carriers, while QFPs use lower-cost plastic molding resins and sheet metal lead frames. Array carriers have considerable cost due to delicate wiring circuitry and chemical processing techniques. Additionally, QFP can apply high-volume molding dies and molding equipment, reducing packaging process steps compared to BGA packaging.
Regarding BGA package cost, the most common BGA packages suitable for the number of I/O pins contain all circuitry on the sides of the package carrier and have no defined vias, leading to additional costs. However, the efficient assembly speed of BGA package can make up for its high cost to a certain extent. From an economic value perspective, QFP is more suitable when there are less than 200 I/O pins. When the number of I/O pins exceeds 200, various types of BGA packages can be applied instead of QFP.
BGA assembly fits with medical PCB
When manufacturing medical electronic devices, it is crucial to choose the correct PCB assembly method. PCBA manufacturers must consider various factors such as reliability, safety, and quality control. In medical PCB assembly, BGA assembly is usually the preferred assembly method.
Medical devices require high reliability and stability, and BGA assembly can provide these requirements. BGA components are better equipped to disperse and handle heat, making them better suited to withstand high temperatures and humidity than traditional QFP components. Additionally, BGA PCB components can provide higher impedance control and signal integrity, which is vital in medical electronic equipment.
Another important factor is that medical devices often require smaller, lighter, and more compact designs, and BGA components can help achieve these goals. BGA components are smaller than QFP components and can take up less space, resulting in more miniaturized medical devices. Additionally, BGA components can improve manufacturing efficiency and reduce assembly costs because they can be assembled automatically by machines. https://www.fs-pcba.com/
Of course, quality control and reliability are paramount in the medical PCB assembly process. This requires selecting an experienced PCBA manufacturer to ensure product quality and production efficiency. These manufacturers must adhere to industry standards and safety practices, and have top-notch quality control systems to ensure the reliability and safety of medical electronic devices.
In summary, BGA assembly inmedical PCB has many advantages, including high reliability, stability, smaller size, and higher manufacturing efficiency. However, selecting the right PCBA manufacturer is critical to ensuring quality and safety. https://www.fs-pcba.com/medical-pcb/
]]>A detailed explanation of the principles of radio frequency circuitshttp://q-eng.com/diary/230252022-12-07T21:25:28Z2022-12-07T21:25:28Z
A radio frequency circuit refers to a circuit in which the electromagnetic wavelength of the processing signal is on the same order of magnitude as the circuit or device size. At this time, due to the relationship between the size of the electronic device and the size of the wire, the circuit needs to be processed with the relevant theory of distribution parameters. This type of circuit can be considered as a radio frequency circuit, and there is no strict requirement for its frequency, such as the AC transmission line for long-distance transmission (50Hz Or 60Hz) Sometimes it is also dealt with by the relevant theory of RF.
Next, FS PCBA takes the mobile phone RF circuit as an example to introduce the principle of the RF circuit in detail.
The structure and working principle of the radio frequency receiving circuit:
When the mobile phone is receiving the signal, the antenna converts the electromagnetic wave sent by the base station into a weak alternating current signal. After filtering and high-frequency amplification, it is sent to the intermediate frequency for demodulation, and the received baseband information (RXI-P, RXI-N, RXQ-P, RXQ-N) is obtained, which is sent to the logic audio circuit for further processing.
Circuit Analysis - Circuit Structure:
The receiving circuit is composed of antenna, antenna switch, filter, high-amplification tube (low noise amplifier), intermediate frequency integrated block (receiving demodulator) and other circuits. Early mobile phones had primary and secondary mixing circuits, the purpose of which was to lower the receiving frequency before demodulation.
The structure and working principle of the transmitting circuit
When transmitting, the transmitting baseband information processed by the logic circuit is modulated into the transmitting intermediate frequency, and the frequency of the transmitting intermediate frequency signal is changed to 890M-915M (GSM) frequency signal by TX-VCO. After being amplified by the power amplifier, it is converted into electromagnetic waves by the antenna and radiated out.
Circuit Analysis - Circuit Structure:
The transmission circuit is composed of transmission modulator, transmission phase detector, transmission voltage-controlled oscillator (TX-VCO), power amplifier (power amplifier), power controller (power control), transmission transformer and other circuits inside the intermediate frequency.
The structure and working principle of the local oscillator circuit (local oscillator circuit, phase-locked loop circuit, frequency synthesis circuit)
The circuit generates four sections of local oscillator frequency signals (GSM-RX, GSM-TX, DCS-RX, DCS-TX) without any information, and sends them to the IF. The baseband information is modulated and transmitted phase-detected.
Circuit Analysis - Circuit Structure: There are four circuit structures in the mobile phone local oscillator circuit:
a) Composed of frequency synthesis integrated block, receiving voltage-controlled oscillator (RX-VCO), 13M reference clock, and preset frequency reference data (SYN-DAT, SYN-CLK, SYN-RST, SIN-EN)
b) Integrate the frequency synthesis integrated block inside the intermediate frequency, combined with an external RX-VCO (multi-purpose for mid-term phones and Nokia phones)
c) Integrate the frequency synthesis integrated block and the receiving voltage-controlled oscillator (RX-VCO), called the local oscillator integrated block (multi-purpose for mid-term and Samsung phones)
d) Integrate the frequency synthesis integrated block and the receiving voltage-controlled oscillator (RX-VCO) inside the intermediate frequency (multi-use for new models and miscellaneous brands).
It is worth noting that no matter what kind of structural mode is adopted, only the generated frequency is different, and its working principle, direction and function of the generated frequency signal are the same.
Application of radio frequency circuit
RF technology is widely used in many fields, such as: TV, radio, mobile phone, radar, automatic identification system, etc. The term RFID (radio frequency identification) refers to the application of radio frequency identification signals to identify objects. RFID applications include:
1. ETC (Electronic Toll Collection)
2. Railway rolling stock identification and tracking
3. Container identification
4. Identification, authentication and tracking of valuables
5. Object management for commercial retail, healthcare, logistics services, etc.
6. Access control management
7. Animal identification and tracking
]]>Repair Air Conditioning Circuit Board - FS Technologyhttp://q-eng.com/diary/229382022-09-02T12:47:34Z2022-09-02T12:47:34Z https://luozhan2022.wixsite.com/website/post/what-is-turn...
1. Circuit:
(1) If there is a problem with the power supply circuit of the air conditioner PCB, it will be displayed in the form of a blown fuse, which directly indicates that the circuit is short-circuited.
(2) The resistance value can be detected with the ohm plug of the multimeter to judge the short circuit part of the FS technology. After finding the short-circuit part, please replace and repair it in time.
2. FS Technology uses temperature detection circuit:
(1) When the temperature of the thermistor is low, the resistance value is large; on the contrary, the higher the temperature, the smaller the resistance; the resistance value of 25 degrees is about 5-20.
Air Conditioning PCB Repair-fs Technology
(2) It can be measured with the ohm plug of the multimeter. If the measured resistance value is small or infinite, it proves that the thermistor is damaged and must be replaced immediately.
3. Receiver circuit:
(1) Use the DC acceleration of the multimeter to directly measure the ground voltage of the power supply terminal and the signal terminal of the receiving terminal. The normal electrode value is +5 volts and the signal electrode voltage is +2.5 volts.
(2) If the value is wrong, it should be that the receiving head is damaged or the capacitor is defective. Remove them one by one and find out how to maintain them.
4. The crystal oscillator circuit of FS Technology:
(1) After the air conditioner is turned on, use a multimeter to measure the voltage of the two pins of the quartz crystal oscillator, the value is about +2.2 volts; if it is lower than 1.5 volts, the circuit has a problem of stopping vibration.
(2) The quartz crystal tube can be removed and judged by the ohm plug of the multimeter. If it shows an open circuit, it means that the quartz crystal tube is good; if it is a short circuit, the crystal is damaged.
CPU error.
Multilayer circuit board repair-fs technology
The three conditions of power supply voltage +5V, reset voltage and clock pulse signal are necessary conditions for the normal operation of the CPU of the circuit board, otherwise the CPU will not work normally. Therefore, a multimeter can be used to detect the voltage of its working state. If the voltage value is normal and the whole machine does not work, it can be judged that the CPU chip is damaged. If the CPU fails, just replace the CPU.
https://www.tumblr.com/blog/view/fs-technology/6856758382...
]]>Considerations for Designing Clock PCBs-FS Technologyhttp://q-eng.com/diary/228802022-07-01T12:59:34Z2022-07-01T12:59:34Z
The clock crystal and associated circuits should be placed in the center of the PCB and should have a good ground plane, not close to the I/O interface. Clock generation circuits are not allowed in the form of daughter cards or daughter boards, and must be fabricated on separate clock boards or load-bearing boards. Only the equipment related to the clock circuit is installed in the PCB clock circuit area of FS TECH, avoid installing other circuits. Other signal lines should not be routed near or below the crystal: Clock circuits and ground planes are used under the crystal if other signals pass through the plane violating the image plane function. If the signal passes through the ground plane, there will be a small ground loop and affect the continuity of the ground plane.
Ground loops will have problems at high frequencies
Shielding measures can be used to shield the clock crystal and clock circuit;
If the clock case is metal metal, the PCB design must have copper under the crystal, and this part has a good electrical connection to the complete ground (through a porous ground). Advantages of laying ground under the FS Tech clock: The circuits inside the crystal oscillator generate RF currents. If the crystal is encased in a metal case, the DC power source discharges the transient current generated by the case through RF radiation through the ground plane, referenced to the DC voltage and the RF current circuit within the crystal.
fs tech
In short, the metal casing is a single-ended antenna, and the nearest image layer, the ground plane layer, sometimes has two or more radiation coupling effects, as the RF current to the ground.
The bottom of the PCB crystal is also conducive to heat dissipation
The clock circuit and crystal ground will provide an image plane that reduces the common mode currents of the associated crystal and clock circuit, thereby reducing RF emissions. Ground can also absorb differential mode RF currents. This plane must be connected to the complete ground plane through multiple points and through multiple holes, which provides low impedance. To improve the effect of the ground plane, the clock circuit of FS Technology should be close to the ground plane. Since most of the surface mount crystals are packaged in plastic, the SMT packaged crystal has more RF energy radiation than the metal shell crystal, and the RF current in the crystal will radiate into the space and be coupled with other devices.
FS Technology-Only improve high-quality PCB assembly services for customers
FS Technology Static Measuring Device
For most boards from FS Tech, previous tests have not been able to resolve this issue. When certain boards are physically damaged for a specific reason, it's easy to determine the cause of the failure, and most failures still require a multimeter to see some important parts of the board. Order measurements, find problems and troubleshoot.
FS Technology pcb means
Before FS Technology makes measurements, it is necessary to determine whether the circuit is controlled by an analog signal or a digital signal. There are boards with schematics that can be configured by talking to the schematic. However, for boards without a system diagram, there are usually two ways to measure.
1 Check the components on the FS Technology circuit board
Make sure you have a microprocessor on the board, for the 80 series, use the top 51 or DSP extensively if you have such a chip on the board. See if a, the shape of the bus and the table with digital signage take up a lot of space and can be considered a digital table.
Since there is a board without a microprocessor, see in the table section how many chips are installed using the 5V power supply. If FS Technology has multiple 5V power chips, it can be used as a digital boost circuit. Digital circuit design differs from analog circuits, which are generally easier to maintain because it is a step-by-step method of identifying problems. However, in the case of digital circuits, there is no explicit upper and lower connection, as the circuit is fully bus compatible. For this reason, monitoring is particularly problematic as it only focuses on the use of statistical measurements of digital circuits, focusing on the following steps.
Step 1: Use a multimeter to check the short circuit between the power supply and the ground.
Look: find a 5V FS technology chip, measure two points diagonally (such as 7-pin, 14-14-pin, 8-pin, 16-16-pin chips) .... if there is no short circuit between the two , the power supply works normally. If there is a small cell, be sure to find the cause and solve the problem. These steps are the first electronic recommendations for complex boards that need to be managed, especially in-depth analysis of specific problems. Electricity is the first circuit, and the circuit can only be discussed if the power supply is working properly. Therefore, measuring energy consumption is very important and an easy step for the operator.
Step 2: Use a multimeter to check if the FS Technology diodes are working properly.
FS Technology printed circuit boards
Under normal circumstances, the positive and negative points are weighed by resistance, the positive part is weighed from ten to several hundred ohms, and the negative part is weighed from one thousand to one thousand ohms. Diode damage usually occurs when the diode breaks due to overcurrent in the circuit.
Step 3: Measure the volume with a multimeter protection device and check for a short or open circuit.
If there is a problem with this part of the circuit. The next step is to determine if there is a problem with the component itself or the circuit to which it is connected, by connecting the loop and part of the imaginary object to an open or open circuit, which is to be included. This will help identify the problems one by one.
Step 4: Use a multimeter to measure connected circuits, transistors, resistors, etc.
The cost is measurable. on the circuit table. Make sure they agree. If the board is in the form of a bus, there will usually be pull wires on the bus. Measuring the resistance group is an important method, the quality of which can be used to first check the quality of the pump installed on the bus.
FS Technology express pcb
Looking at FS Technology's static measurement method, most board problems can be solved, yes
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